{"product_id":"9780071741965","title":"3D IC Stacking Technology","description":"The latest advances in three-dimensional integrated circuit stacking technology  \u003cp\u003eWith a focus on industrial applications, \u003ci\u003e3D IC Stacking Technology\u003c\/i\u003e offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.\u003c\/p\u003e  \u003cp\u003e\u003ci\u003e3D IC Stacking Technology\u003c\/i\u003e covers:\u003c\/p\u003e  \u003cul\u003e\n\u003cli\u003eHigh density through silicon stacking (TSS) technology\u003c\/li\u003e  \u003cli\u003ePractical design ecosystem for heterogeneous 3D IC products\u003c\/li\u003e  \u003cli\u003eDesign automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack\u003c\/li\u003e  \u003cli\u003eProcess integration for TSV manufacturing\u003c\/li\u003e  \u003cli\u003eHigh-aspect-ratio silicon etch for TSV\u003c\/li\u003e  \u003cli\u003eDielectric deposition for TSV\u003c\/li\u003e  \u003cli\u003eBarrier and seed deposition\u003c\/li\u003e  \u003cli\u003eCopper electrodeposition for TSV\u003c\/li\u003e  \u003cli\u003eChemical mechanical polishing for TSV applications\u003c\/li\u003e  \u003cli\u003eTemporary and permanent bonding\u003c\/li\u003e  \u003cli\u003eAssembly and test aspects of TSV technology\u003c\/li\u003e  \u003c\/ul\u003e","brand":"McGraw Hill LLC","offers":[{"title":"Default Title","offer_id":46570046193905,"sku":"9780071741965","price":155.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0674\/5433\/7265\/files\/9780071741965_p0.jpg?v=1765831680","url":"https:\/\/shop.barnesandnoble.com\/products\/9780071741965","provider":"Barnes \u0026 Noble","version":"1.0","type":"link"}