{"product_id":"9789401790376","title":"Electrical Design of Through Silicon Via","description":"Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered. ","brand":"Springer Netherlands","offers":[{"title":"Default Title","offer_id":46409582772465,"sku":"9789401790376","price":109.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0674\/5433\/7265\/files\/9789401790376_p0.jpg?v=1764996930","url":"https:\/\/shop.barnesandnoble.com\/products\/9789401790376","provider":"Barnes \u0026 Noble","version":"1.0","type":"link"}